Tatung Advancedceramics Co., Ltd

Metallized ceramic substrates

Metallized ceramic substrates

Our stamped, lasered or dry-pressed ceramic substrates, with their excellent mechanical, electrical and thermal characteristics, are metallized at our in-house facilities.
The unique developed pastes are characterized by high adhesive strength, good flux and excellent stability in solder baths. Their excellent mechanical, electrical and thermal properties make our metallized substrates suitable for use in the application including power electronics, rectifiers, thyristor , ignition elements, coil winding components ,heating and cooling elements and microelectronic etc.
Metallizing System
The base layer is tungsten or moly-manganese, screen printed with a minimum layer thickness of 6 µm. An electrolytic nickel layer (approximately 2 µm) assures a good solder flow. Other thicknesses are available for specific customer requirements. Electrolytic nickel plating requires electrical connections for the plating process. Special design guidelines will therefore apply wherever an electrolytic technique is involved.
An optional gold flash layer (approximately 0,1 µm) may be added to enhance corrosion resistance. As a further option, the electrolytic nickel layer may be covered with bondable gold plating. Solder finishes are also available.